TIA800FG is based on glass fiber. This kind of heat-conducting double-sided adhesive tape has the properties of heat dissipation and insulation, and can be punched into any specifications. The heat-conducting double-sided adhesive tape is widely used to bond heat sinks to microprocessors and other power-consuming semiconductors. These tapes have strong bonding strength and low thermal impedance, which can effectively replace grease and mechanical fixation.